US Patent Issued to Taiwan Semiconductor Manufacturing on March 25 for "Info structure with copper pillar having reversed profile" (Taiwanese Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,074, issued on March 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsin-Chu, Taiwan).

"Info structure with copper pillar having reversed profile" was invented by Hsi-Kuei Cheng (Zhubei, Taiwan), Ching Fu Chang (Taipei, Taiwan), Chih-Kang Han (Hsinchu, Taiwan) and Hsin-Chieh Huang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes forming a first polymer layer to cover a metal pad of a wafer, and patterning the first polymer layer to form a first opening. A first sidewall of the first polymer layer exposed to the first opening has a first tilt angle where the first sidewall is in contact with the met...