US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on March 25 for "Damping device and method of making" (Taiwanese Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,129, issued on March 25, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd. (Hsin-Chu, Taiwan).

"Damping device and method of making" was invented by Jheng-Hong Jiang (Hsinchu, Taiwan), Shing-Huang Wu (Hsinchu, Taiwan) and Chia-Wei Liu (Zhubei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A damping device is provided. The damping device includes a damper including a mechanical deflector. The damping device includes a post coupled to the mechanical deflector. The damping device includes a case in which the damper is disposed."

The patent was filed on Jan. 24, 2022, under Application No. 17/582,091.

*For further information, i...