US Patent Issued to Taiwan Semiconductor Manufacturing on March 25 for "Bonding process for forming semiconductor device structure" (Taiwanese Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,258,265, issued on March 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Bonding process for forming semiconductor device structure" was invented by Chih-Hang Chang (Taoyuan, Taiwan), I-Shi Wang (Sanxia Township, Taiwan) and Jen-Hao Liu (Zhunan Township, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device structure is provided. The semiconductor device structure includes a first substrate including a first face and a second face opposite the first face. A second substrate is bonded to the first face of the first substrate such that the second face of the first substrate faces away from the se...