US Patent Issued to Taiwan Semiconductor Manufacturing on March 25 for "Apparatus and method for wafer cleaning" (Taiwanese Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,257,610, issued on March 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Apparatus and method for wafer cleaning" was invented by Bo Chen Chen (Hsinchu, Taiwan), Sheng-Wei Wu (Zhubei, Taiwan) and Yung-Li Tsai (Houlong Town, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to an apparatus and a method for wafer cleaning. The apparatus can include a wafer holder configured to hold a wafer; a cleaning nozzle configured to dispense a cleaning fluid onto a first surface (e.g., front surface) of the wafer; and a cleaning brush configured to clean a second surface (e.g., back surface) of ...