US Patent Issued to Taiwan Semiconductor Manufacturing on March 18 for "Semiconductor structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,116, issued on March 18, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor structure and manufacturing method thereof" was invented by Ming-Fa Chen (Taichung, Taiwan), Ta-Hao Sung (Yilan County, Taiwan) and Sung-Feng Yeh (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure and a manufacturing method thereof are provided. The semiconductor structure includes first semiconductor dies spaced apart from one another, second semiconductor dies stacked upon the first semiconductor dies with a one-to-one correspondence and electrically coupled to the first semiconductor dies, a...