US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on March 18 for "Semiconductor packages and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,184, issued on March 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor packages and methods of forming the same" was invented by Chen-Hua Yu (Hsinchu, Taiwan), Ming Hung Tseng (Miaoli County, Taiwan), Yen-Liang Lin (Taichung, Taiwan), Tzu-Sung Huang (Tainan, Taiwan), Tin-Hao Kuo (Hsinchu, Taiwan) and Hao-Yi Tsai (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A device includes a first redistribution structure comprising a first conductive line and a second conductive line. An integrated circuit die is attached to the first redistribution structure. A first via is coupled to the fir...