US Patent Issued to Taiwan Semiconductor Manufacturing on March 18 for "Semiconductor package with thermal relaxation block and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,196, issued on March 18, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package with thermal relaxation block and manufacturing method thereof" was invented by Shih-Wei Chen (Hsinchu, Taiwan), Chih-Hua Chen (Hsinchu County, Taiwan), Hsin-Yu Pan (Taipei, Taiwan), Hao-Yi Tsai (Hsinchu, Taiwan), Lipu Kris Chuang (Hsinchu, Taiwan) and Tin-Hao Kuo (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Manufacturing method of semiconductor package includes following steps. Bottom package is provided. The bottom package includes a die and a redistribution structure electrically connected to die. A fi...