US Patent Issued to Taiwan Semiconductor Manufacturing on March 18 for "Semiconductor package with riveting structure between two rings and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,156, issued on March 18, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package with riveting structure between two rings and method for forming the same" was invented by Chien Hung Chen (Taipei, Taiwan), Shu-Shen Yeh (Taoyuan, Taiwan), Po-Chen Lai (Hsinchu, Taiwan), Po-Yao Lin (Zhudong Township, Taiwan) and Shin-Puu Jeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package and a method of forming the same are provided. The semiconductor package includes a package substrate and a semiconductor device mounted on the surface of the package substrate. A first ring is dis...