US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on March 18 for "Semiconductor package structure comprising via structure and redistribution layer structure" (Taiwanese Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,166, issued on March 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor package structure comprising via structure and redistribution layer structure" was invented by Neng-Chieh Chang (Tainan, Taiwan), Po-Hao Tsai (Taoyuan, Taiwan), Ming-Da Cheng (Taoyuan, Taiwan), Wen-Hsiung Lu (Tainan, Taiwan) and Hsu-Lun Liu (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package structure includes a conductive pad formed over a substrate. The semiconductor package structure also includes a passivation layer formed over the conductive pad. The semiconductor package structure furthe...