US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on March 18 for "Semiconductor package device with integrated inductor and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,157, issued on March 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor package device with integrated inductor and manufacturing method thereof" was invented by Wen-Shiang Liao (Miaoli County, Taiwan) and Huan-Neng Chen (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes: forming an interconnect structure over a semiconductor substrate. The interconnect structure includes: a magnetic core and a conductive coil winding around the magnetic core and electrically insulated from the magnetic core. The conductive coil includes horizontally-extending conductive lines and ve...