US Patent Issued to Taiwan Semiconductor Manufacturing on March 18 for "Semiconductor devices and methods of manufacturing" (Taiwanese Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,078, issued on March 18, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor devices and methods of manufacturing" was invented by Po-Chen Lai (Hsinchu, Taiwan), Ming-Chih Yew (Hsinchu, Taiwan), Po-Yao Lin (Zhudong Township, Taiwan), Chien-Sheng Chen (Hsinchu, Taiwan) and Shin-Puu Jeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor devices and methods of manufactured are presented in which a first redistribution structure is formed, semiconductor devices are bonded to the first redistribution structure, and the semiconductor devices are encapsulated in an encapsulant. First op...