US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on March 18 for "Semiconductor devices and methods of manufacturing" (Taiwanese Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,070, issued on March 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor devices and methods of manufacturing" was invented by Min-Hsuan Lu (Hsinchu, Taiwan), Kan-Ju Lin (Kaohsiung, Taiwan), Lin-Yu Huang (Hsinchu, Taiwan), Sheng-Tsung Wang (Hsinchu, Taiwan), Hung-Yi Huang (Hsinchu, Taiwan), Chih-Wei Chang (Hsinchu, Taiwan), Ming-Hsing Tsai (Chu-Pei, Taiwan) and Chih-Hao Wang (Baoshan Township, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In a semiconductor structure, a first conductive feature is formed in a trench by PVD and a glue layer is then deposited on the first conductive feature in...