US Patent Issued to Taiwan Semiconductor Manufacturing on March 18 for "Semiconductor device with isolation structure" (Taiwanese Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,205, issued on March 18, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor device with isolation structure" was invented by Chieh-Ping Wang (Hsinchu, Taiwan), Tai-Chun Huang (Hsin-Chu, Taiwan), Yung-Cheng Lu (Hsinchu, Taiwan), Ting-Gang Chen (Taipei, Taiwan) and Chi On Chui (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device with isolation structures of different dielectric constants and a method of fabricating the same are disclosed. The semiconductor device includes fin structures with first and second fin portions disposed on first and second device areas on a substra...