ALEXANDRIA, Va., March 19 -- United States Patent no. 12,256,648, issued on March 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).
"Seal structures" was invented by Chun Yu Chen (Hsinchu, Taiwan) and Yen Lian Lai (Hsinchu County, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Integrated circuit (IC) chips and seal ring structures are provided. An IC chip according to the present disclosure includes a device region, an inner ring surrounding the device region, an outer ring surrounding the inner ring, a first corner area between an outer corner of the inner ring and an inner corner of the outer ring, and a second corner area disposed at an outer corner of the outer...