US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on March 18 for "Power distribution structure and method" (Taiwanese Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,148, issued on March 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Power distribution structure and method" was invented by Shih-Wei Peng (Hsinchu, Taiwan), Te-Hsin Chiu (Hsinchu, Taiwan) and Jiann-Tyng Tzeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An IC package includes a first die including a front side and a back side, the front side including a first signal routing structure, the back side including a first power distribution structure, and a second die including a front side and a back side, the front side including a second signal routing structure, the back side including a se...