US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on March 18 for "Pellicle design for mask application" (Taiwanese Inventor)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,253,797, issued on March 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan).

"Pellicle design for mask application" was invented by Yun-Yue Lin (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides an apparatus for a semiconductor lithography process. The apparatus includes a mask defining a circuit pattern to be transferred. The apparatus further includes a pellicle including a pattern formed in a first surface, wherein the pellicle is attached to the mask at the first surface. The apparatus also includes an adhesive material layer disposed between the mask and the first surface....