US Patent Issued to Taiwan Semiconductor Manufacturing on March 18 for "Package structure with stacked semiconductor dies" (Taiwanese Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,155, issued on March 18, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package structure with stacked semiconductor dies" was invented by Yi-Chao Mao (Zhongli, Taiwan), Chin-Chuan Chang (Zhudong Township, Taiwan) and Szu-Wei Lu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure is provided. The package structure includes a lower semiconductor die and a first protective layer surrounding the lower semiconductor die. The package structure also includes a dielectric layer partially covering the first protective layer and the lower semiconductor die and an upper semiconductor die over t...