US Patent Issued to Taiwan Semiconductor Manufacturing on March 18 for "Monolithic three dimensional integrated circuit" (Taiwanese Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,203, issued on March 18, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Monolithic three dimensional integrated circuit" was invented by Kam-Tou Sio (Zhubei, Taiwan), Jiann-Tyng Tzeng (Hsinchu, Taiwan) and Shih-Wei Peng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A monolithic three dimensional integrated circuit is provided. The monolithic three dimensional integrated circuit includes a first cell layer having a first cell having a first active component of the monolithic three dimensional integrated circuit. A second layer having a second cell including a second active component. The second cell...