US Patent Issued to Taiwan Semiconductor Manufacturing on March 18 for "Liner layer for backside contacts of semiconductor devices" (Taiwanese Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,239, issued on March 18, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Liner layer for backside contacts of semiconductor devices" was invented by Mrunal Abhijith Khaderbad (Hsinchu, Taiwan), Keng-Chu Lin (Ping-Tung, Taiwan) and Yu-Yun Peng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure describes a semiconductor device that includes a transistor. The transistor includes a source/drain region that includes a front surface and a back surface opposite to the front surface. The transistor includes a salicide region on the back surface and a channel region in contact with the sour...