ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,062, issued on March 18, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsin-Chu, Taiwan).
"Integrate rinse module in hybrid bonding platform" was invented by Xin-Hua Huang (Xihu Township, Taiwan), Ping-Yin Liu (Yonghe, Taiwan), Hung-Hua Lin (Taipei, Taiwan), Hsun-Chung Kuang (Hsinchu, Taiwan), Yuan-Chih Hsieh (Hsinchu, Taiwan), Lan-Lin Chao (Sindian, Taiwan), Chia-Shiung Tsai (Hsinchu, Taiwan) and Xiaomeng Chen (Baoshan Township, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes performing a plasma activation on a surface of a first package component, removing oxide regions from surfaces of metal pads of the fir...