US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on March 18 for "Circuit test structure and method of using" (Taiwanese Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,253,558, issued on March 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Circuit test structure and method of using" was invented by Ching-Fang Chen (Hsinchu, Taiwan), Hsiang-Tai Lu (Hsinchu, Taiwan) and Chih-Hsien Lin (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit test structure includes a chip including a conductive line which traces a perimeter of the chip. The circuit test structure further includes an interposer electrically connected to the chip, wherein the conductive line is over both the chip and the interposer. The circuit test structure further includes a test structure conne...