ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,173, issued on March 18, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Chip package structure" was invented by Ling-Wei Li (Hsinchu, Taiwan), Jung-Hua Chang (Hsinchu, Taiwan) and Cheng-Lin Huang (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A chip package structure is provided. The chip package structure includes a first substrate. The chip package structure includes a conductive via structure passing through the first substrate. The chip package structure includes a barrier layer over a surface of the first substrate. The chip package structure includes an insulating layer over the barrier layer....