US Patent Issued to Taiwan Semiconductor Manufacturing on March 18 for "Boundary design to reduce memory array edge CMP dishing effect" (Taiwanese Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,256,549, issued on March 18, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Boundary design to reduce memory array edge CMP dishing effect" was invented by Wei Cheng Wu (Zhubei, Taiwan) and Chien-Hung Chang (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In some embodiments, the present disclosure relates to an integrated chip. The integrated chip includes a plurality of transistor devices disposed on or within a substrate and a plurality of memory devices disposed on or within the substrate. A first isolation structure is disposed within the substrate between the plurality of transistor devices and the p...