US Patent Issued to Taiwan Semiconductor Manufacturing on March 18 for "Boundary design for high-voltage integration on HKMG technology" (Taiwanese, American Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,207, issued on March 18, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Boundary design for high-voltage integration on HKMG technology" was invented by Yi-Huan Chen (Hsin Chu, Taiwan), Chien-Chih Chou (New Taipei, Taiwan), Alexander Kalnitsky (San Francisco), Kong-Beng Thei (Pao-Shan Village, Taiwan), Ming Chyi Liu (Hsinchu, Taiwan), Shih-Chung Hsiao (New Taipei, Taiwan) and Jhih-Bin Chen (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to an integrated circuit (IC) that includes a boundary region defined between a low voltage region and a high voltage region, and a met...