US Patent Issued to Taiwan Semiconductor Manufacturing on March 18 for "Bonding passive devices on active dies to form 3D packages" (Taiwanese Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,174, issued on March 18, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Bonding passive devices on active dies to form 3D packages" was invented by Chen-Hua Yu (Hsinchu, Taiwan), Kuo Lung Pan (Hsinchu, Taiwan), Shu-Rong Chun (Hsinchu, Taiwan), Chi-Hui Lai (Taichung, Taiwan), Tin-Hao Kuo (Hsinchu, Taiwan), Hao-Yi Tsai (Hsinchu, Taiwan) and Chung-Shi Liu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package includes a package substrate, an interposer over and bonded to the package substrate, a first wafer over and bonding to the interposer, and a second wafer over and bonding to the first wafer. Th...