ALEXANDRIA, Va., March 12 -- United States Patent no. 12,249,520, issued on March 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan).
"Wet etch apparatus" was invented by Hong-Ting Lu (Taichung, Taiwan) and Han-Wen Liao (Taichung, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wet etch apparatus includes a wafer chuck, a dispensing nozzle, a liquid etchant container, and an electric field generator. The dispensing nozzle is above the wafer chuck. The liquid etchant container is in fluid communication with the dispensing nozzle. The electric field generator is operative to generate an electric field across the wafer chuck. The electric field generator includes a first e...