US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on March 11 for "Semiconductor device package including a thermal conductive layer and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., March 12 -- United States Patent no. 12,249,555, issued on March 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor device package including a thermal conductive layer and methods of forming the same" was invented by Cheng-Chin Lee (Taipei, Taiwan), Cherng-Shiaw Tsai (New Taipei, Taiwan), Shao-Kuan Lee (Kaohsiung, Taiwan), Hsiao-kang Chang (Hsinchu, Taiwan), Hsin-Yen Huang (New Taipei, Taiwan) and Shau-Lin Shue (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device package, along with methods of forming such, are described. The semiconductor device package includes a first semiconductor device structure having...