US Patent Issued to Taiwan Semiconductor Manufacturing on March 11 for "Passivation scheme design for wafer singulation" (Taiwanese Inventors)

ALEXANDRIA, Va., March 12 -- United States Patent no. 12,249,580, issued on March 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Passivation scheme design for wafer singulation" was invented by Hsien-Wei Chen (Hsinchu, Taiwan), Ying-Ju Chen (Tuku Township, Taiwan) and Ming-Fa Chen (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a semiconductor device includes: forming first electrical components in a substrate in a first device region of the semiconductor device; forming a first interconnect structure over and electrically coupled to the first electrical components; forming a first passivation layer over the first interconnect structur...