US Patent Issued to Taiwan Semiconductor Manufacturing on March 11 for "Packaged device including an optical path structure aligned to an optical feature" (Taiwanese Inventors)

ALEXANDRIA, Va., March 12 -- United States Patent no. 12,248,178, issued on March 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Packaged device including an optical path structure aligned to an optical feature" was invented by Hsien-Wei Chen (Hsinchu, Taiwan) and Ming-Fa Chen (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A packaged device includes an optical IC having an optical feature therein. An interconnect structure including layers of conductive features embedded within respective layers of dielectric materials overlie the optical feature. The interconnect structure is patterned to remove the interconnect structure from over the optical feature a...