US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on March 11 for "Method for manufacturing semiconductor wafer with wafer chuck having fluid guiding structure" (Taiwanese Inventors)

ALEXANDRIA, Va., March 12 -- United States Patent no. 12,249,493, issued on March 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan).

"Method for manufacturing semiconductor wafer with wafer chuck having fluid guiding structure" was invented by Sheng-Chun Yang (Tainan, Taiwan), Yi-Ming Lin (Tainan, Taiwan), Po-Wei Liang (Yilan County, Taiwan), Chu-Han Hsieh (Tainan, Taiwan), Chih-Lung Cheng (Miaoli County, Taiwan) and Po-Chih Huang (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes loading a wafer over a wafer chuck in a process chamber; performing a deposition process on the loaded wafer; supplying a fluid medium to a fluid guiding structure in th...