US Patent Issued to Taiwan Semiconductor Manufacturing on March 11 for "Dynamic bonding gap control and tool for wafer bonding" (Taiwanese Inventors)

ALEXANDRIA, Va., March 12 -- United States Patent no. 12,249,592, issued on March 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Dynamic bonding gap control and tool for wafer bonding" was invented by Han-De Chen (Hsinchu, Taiwan), Cheng-I Chu (Taipei, Taiwan), Yun Chen Teng (New Taipei, Taiwan), Chen-Fong Tsai (Hsinchu, Taiwan), Jyh-Cherng Sheu (Hsinchu, Taiwan), Huicheng Chang (Tainan, Taiwan) and Yee-Chia Yeo (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes placing a first wafer on a first wafer stage, placing a second wafer on a second wafer stage, and pushing a center portion of the first wafer to contact the second wafer. A bonding w...