ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,640, issued on June 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Semiconductor package and manufacturing method thereof" was invented by Sheng-Chieh Yang (Hsinchu, Taiwan), Shing-Chao Chen (Hsinchu County, Taiwan), Ching-Hua Hsieh (Hsinchu, Taiwan) and Chih-Wei Lin (Hsinchu County, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a semiconductor device, an encapsulating material encapsulating the semiconductor device, and a redistribution structure disposed over the encapsulating material and the semiconductor device. The semiconductor device includes conductive bumps and a d...