US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 3 for "Semiconductor lithography system and/or method" (Taiwanese Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,321,100, issued on June 3, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd. (Hsin-Chu, Taiwan).

"Semiconductor lithography system and/or method" was invented by Tsiao-Chen Wu (Jhudong Township, Taiwan), Chi-Ming Yang (Hsinchu, Taiwan) and Hsu-Shui Liu (Pingjhen, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A lithography method to pattern a first semiconductor wafer is disclosed. An optical mask is positioned over the first semiconductor wafer. A first region of the first semiconductor wafer is patterned by directing light from a light source through transparent regions of the optical mask. A second region of the first semiconducto...