US Patent Issued to Taiwan Semiconductor Manufacturing on June 3 for "Semiconductor device and method" (Taiwanese Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,324,230, issued on June 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor device and method" was invented by Hsi-Jung Wu (Kaohsiung, Taiwan), Sheng-Fu Yu (Chiayi, Taiwan), Ru-Shang Hsiao (Jhubei, Taiwan) and Ying-Hsin Lu (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An embodiment includes a semiconductor device, a plurality of fin structures extending from a substrate, the plurality of fin structures having a plurality of first fin structures and a plurality of second fin structures. The semiconductor device also includes a plurality of isolation regions on the substrate and disposed between...