ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,723, issued on June 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Self-aligned interconnect structure" was invented by Hsin-Chieh Yao (Hsinchu, Taiwan), Chung-Ju Lee (Hsinchu, Taiwan), Chih Wei Lu (Hsinchu, Taiwan), Hsi-Wen Tien (Xinfeng Township, Taiwan), Yu-Teng Dai (New Taipei, Taiwan) and Wei-Hao Liao (Taichung, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a semiconductor structure including an interconnect structure disposed over a semiconductor substrate. A lower metal line is disposed at a first height over the semiconductor substrate and extends through a first in...