US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 3 for "Package structure with underfill" (Taiwanese Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,704, issued on June 3, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Package structure with underfill" was invented by Yu-Sheng Lin (Zhubei, Taiwan), Shin-Puu Jeng (Hsinchu, Taiwan), Po-Yao Lin (Zhudong Township, Hsinchu County, Taiwan), Chin-Hua Wang (New Taipei, Taiwan), Shu-Shen Yeh (Taoyuan, Taiwan) and Che-Chia Yang (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure is provided. The package structure includes a substrate having interior sidewalls forming a recess. The interior sidewalls have an upper sidewall, a lower sidewall, and an intermediate sidewall. The intermediate si...