US Patent Issued to Taiwan Semiconductor Manufacturing on June 3 for "Package structure including auxiliary dielectric portion" (Taiwanese Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,688, issued on June 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package structure including auxiliary dielectric portion" was invented by Po-Han Wang (Hsinchu, Taiwan), Sih-Hao Liao (New Taipei, Taiwan), Wei-Chih Chen (Taipei, Taiwan), Hung-Chun Cho (Hsinchu, Taiwan), Ting-Chen Tseng (Hsinchu, Taiwan), Yu-Hsiang Hu (Hsinchu, Taiwan) and Hung-Jui Kuo (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes a first redistribution layer, a semiconductor die and a second redistribution layer. The first redistribution layer includes a first dielectric layer, first conductive elemen...