US Patent Issued to Taiwan Semiconductor Manufacturing on June 3 for "Package structure and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,691, issued on June 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package structure and method of manufacturing the same" was invented by Chuei-Tang Wang (Taichung, Taiwan), Chun-Lin Lu (Hsinchu, Taiwan) and Kai-Chiang Wu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes a conductive feature structure, a die, an adhesive layer, an insulator, a through via, and an encapsulant. The die is disposed over the conductive feature structure. The adhesive layer is disposed below the die. The insulator is disposed between the adhesive layer and a polymer layer of the conductive fea...