US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 3 for "Methods of resistance and capacitance reduction to circuit output nodes" (Taiwanese, American Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,324,228, issued on June 3, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan).

"Methods of resistance and capacitance reduction to circuit output nodes" was invented by Po-Chia Lai (Fremont, Calif.), Shang-Wei Fang (Hsinchu, Taiwan), Meng-Hung Shen (Hsinchu County, Taiwan), Jiann-Tyng Tzeng (Hsinchu, Taiwan), Ting-Wei Chiang (New Taipei, Taiwan), Jung-Chan Yang (Taoyuan, Taiwan) and Stefan Rusu (Sunnyvale, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit is provided, including a first conductive pattern, at least one first conductive segment, and a first via. The first conductive pattern is disposed i...