US Patent Issued to Taiwan Semiconductor Manufacturing on June 3 for "Methods and apparatus for package with interposers" (Taiwanese Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,670, issued on June 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsin-Chu, Taiwan).

"Methods and apparatus for package with interposers" was invented by Chun-Lin Lu (Hsinchu, Taiwan), Kai-Chiang Wu (Hsinchu, Taiwan), Yen-Ping Wang (Hemei Township, Taiwan), Shih-Wei Liang (Dajia Township, Taiwan) and Ching-Feng Yang (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An interposer may comprise a metal layer above a substrate. A dam or a plurality of dams may be formed above the metal layer. A dam surrounds an area of a size larger than a size of a die which may be connected to a contact pad above the metal layer within th...