US Patent Issued to Taiwan Semiconductor Manufacturing on June 3 for "Method of forming integrated chip structure having slotted bond pad in stacked wafer structure" (Taiwanese Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,715, issued on June 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Method of forming integrated chip structure having slotted bond pad in stacked wafer structure" was invented by Harry-Hak-Lay Chuang (Zhubei, Taiwan), Li-Feng Teng (Hsinchu, Taiwan) and Wei Cheng Wu (Zhubei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates integrated chip structure. The integrated chip structure includes one or more interconnects disposed within a dielectric structure over a substrate. A bond pad having a top surface is arranged along a top surface of the dielectric structure. The top surface of t...