US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 3 for "Height adjustable semiconductor wafer support" (Taiwanese Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,643, issued on June 3, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd. (Hsin-Chu, Taiwan).

"Height adjustable semiconductor wafer support" was invented by Ming Shing (Hsinchu County, Taiwan), Yichi Yen (Hsinchu, Taiwan), Chun Liang Chen (Taoyuan, Taiwan) and Kuo Lun Lo (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A height adjustable semiconductor wafer support is provided. The height adjustable semiconductor wafer support includes a chuck for supporting a semiconductor wafer, an adjustment mechanism having a top surface for supporting the chuck, and a stage coupled to the adjustment mechanism such that moveme...