US Patent Issued to Taiwan Semiconductor Manufacturing on June 3 for "Different scaling ratio in FEOL / MOL/ BEOL" (Taiwanese Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,701, issued on June 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Different scaling ratio in FEOL / MOL/ BEOL" was invented by Liang-Yao Lee (Taoyuan, Taiwan), Tsung-Chieh Tsai (Chu-Bei, Taiwan), Juing-Yi Wu (Hsinchu, Taiwan) and Chun-Yi Lee (Beipu Township, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip includes a first contact and a second contact disposed over a substrate. A center of a first upper surface of the first contact is laterally separated from a center of a second upper surface of the second contact...