US Patent Issued to Taiwan Semiconductor Manufacturing on June 3 for "Die attached leveling control by metal stopper bumps" (Taiwanese Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,722, issued on June 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Die attached leveling control by metal stopper bumps" was invented by Wei-Jhih Mao (Taipei, Taiwan), Kuei-Sung Chang (Kaohsiung, Taiwan) and Shang-Ying Tsai (Pingzhen, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In some embodiments, the present disclosure relates to an integrated chip (IC), including a substrate, a first die disposed over the substrate, a metal wire attached to a frontside of the first die, and a first plurality of die stopper bumps disposed along a backside of the first die and configured to control an angle of operation ...