US Patent Issued to Taiwan Semiconductor Manufacturing on June 3 for "Device and method for UBM/RDL routing" (Taiwanese Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,727, issued on June 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsin-Chu, Taiwan).

"Device and method for UBM/RDL routing" was invented by Meng-Tsan Lee (Hsinchu, Taiwan), Wei-Cheng Wu (Hsinchu, Taiwan) and Tsung-Shu Lin (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An under bump metallurgy (UBM) and redistribution layer (RDL) routing structure includes an RDL formed over a die. The RDL comprises a first conductive portion and a second conductive portion. The first conductive portion and the second conductive portion are at a same level in the RDL. The first conductive portion of the RDL is separated from the ...