ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,615, issued on June 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"De-tape tool" was invented by Chen Liang Chang (Taipei, Taiwan), Kuo Hui Chang (Taoyuan County, Taiwan), Ryder Su (Keelung, Taiwan) and Chi-Chun Peng (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of removing a sacrificial substructure from a support structure is disclosed. The method includes receiving the support structure, where the support structure has the sacrificial substructure connected thereto, the sacrificial substructure having functioning electrical devices removed therefrom. The method also includes applying a...