US Patent Issued to Taiwan Semiconductor Manufacturing on June 3 for "Chip package and method of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,706, issued on June 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Chip package and method of forming the same" was invented by Kuo-Lung Pan (Hsinchu, Taiwan), Hao-Yi Tsai (Hsinchu, Taiwan) and Tin-Hao Kuo (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip package including a first semiconductor die, a support structure and a second semiconductor die is provided. The first semiconductor die includes a first dielectric layer and a plurality of conductive vias, the first dielectric layer includes a first region and a second region, the conductive vias is embedded in the first region of the first d...