US Patent Issued to Taiwan Semiconductor Manufacturing on June 3 for "Apparatus and methods for cleaning a package" (Taiwanese Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,608, issued on June 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Apparatus and methods for cleaning a package" was invented by Ying-Hao Wang (Tainan, Taiwan), Chien-Lung Chen (Zhubei, Taiwan), Chien-Chi Tzeng (Hsinchu, Taiwan), Meng-Fu Shih (Taichung, Taiwan) and Hu-Wei Lin (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus for cleaning a package device is provided. The apparatus includes a package device loader; a package device unloader; a first cleaning area disposed between the package device loader and the package device unloader; and a conveyor. The conveyor includes a frame extend...