US Patent Issued to Taiwan Semiconductor Manufacturing on June 3 for "Apparatus and method for automated wafer carrier handling" (Taiwanese Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,628, issued on June 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Apparatus and method for automated wafer carrier handling" was invented by Ren-Hau Wu (New Taipei, Taiwan), Cheng-Lung Wu (Hsinchu, Taiwan), Jiun-Rong Pai (Hsinchu County, Taiwan) and Cheng-Kang Hu (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus for automated wafer carrier handling includes a base plate and an active expansion component movably coupled to the base plate. The active expansion component is configured to change from a contracted form to an expanded form so as to be engaged with a top flange mounted on a w...