US Patent Issued to Taiwan Semiconductor Manufacturing on June 3 for "3DIC with heat dissipation structure and warpage control" (Taiwanese Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,673, issued on June 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"3DIC with heat dissipation structure and warpage control" was invented by Kuo-Chiang Ting (Hsinchu, Taiwan), Sung-Feng Yeh (Taipei, Taiwan), Ta Hao Sung (Hsinchu, Taiwan) and Jian-Wei Hong (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes bonding a bottom die to a carrier, and bonding a top die to the bottom die. The top die includes a semiconductor substrate, and the semiconductor substrate has a first thermal conductivity. The method further includes encapsulating the top die in a gap-fill region, bonding a supporti...